X76F041WEG-3
vs
AT24C04A-W1.8-11
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Not Recommended
Ihs Manufacturer
IC MICROSYSTEMS SDN BHD
MICROCHIP TECHNOLOGY INC
Part Package Code
WAFER
Package Description
ROHS COMPLIANT, WAFER
DIE
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
PASS SECURE FLASH
Clock Frequency-Max (fCLK)
1 MHz
0.1 MHz
JESD-30 Code
X-XUUC-N
X-XUUC-N
Memory Density
4096 bit
4096 bit
Memory IC Type
FLASH
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Organization
512X8
512X8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
1.8 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
Write Cycle Time-Max (tWC)
10 ms
5 ms
Base Number Matches
1
2
Endurance
1000000 Write/Erase Cycles
I2C Control Byte
1010DDXR
Serial Bus Type
I2C
Compare X76F041WEG-3 with alternatives
Compare AT24C04A-W1.8-11 with alternatives