Findchips: Compare X76F041WE-3 vs X76F400HIG

X76F041WE-3 vs X76F400HIG feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Contact Manufacturer
Ihs Manufacturer	XICOR INC	IC MICROSYSTEMS SDN BHD
Package Description	WAFER	DIE,
Reach Compliance Code	unknown	unknown
Additional Feature	PASS SECURE FLASH	DATA RETENTION = 100 YEARS
Clock Frequency-Max (fCLK)	1 MHz
JESD-30 Code	X-XUUC-N	X-XUUC-N
Memory Density	4096 bit	4096 bit
Memory IC Type	FLASH	FLASH
Memory Width	8	8
Number of Functions	1	1
Number of Words	512 words	512 words
Number of Words Code	512	512
Operating Mode	SYNCHRONOUS	SYNCHRONOUS
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-20 °C	-40 °C
Organization	512X8	512X8
Output Characteristics	3-STATE
Package Body Material	UNSPECIFIED	UNSPECIFIED
Package Code	DIE	DIE
Package Shape	UNSPECIFIED	UNSPECIFIED
Package Style	UNCASED CHIP	UNCASED CHIP
Parallel/Serial	SERIAL	SERIAL
Programming Voltage	3 V	5 V
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	3.6 V	5.5 V
Supply Voltage-Min (Vsup)	3 V	4.5 V
Supply Voltage-Nom (Vsup)	3.3 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER	INDUSTRIAL
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	UPPER
Type	NOR TYPE	NOR TYPE
Write Cycle Time-Max (tWC)	10 ms	10 ms
Base Number Matches	2	1
Pbfree Code		Yes
Rohs Code		Yes
Part Package Code		DIE
ECCN Code		EAR99
HTS Code		8542.32.00.51
Data Retention Time-Min		100
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Memory » Flash Memories	Memory » Flash Memories