X28HC64JIZ-70T1
vs
X28HC64JM-70
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
Part Package Code |
PLCC
|
QFJ
|
Package Description |
,
|
PLASTIC, LCC-32
|
Pin Count |
32
|
32
|
Manufacturer Package Code |
N32.45X55
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Date Of Intro |
2018-02-02
|
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Access Time-Max |
70 ns
|
70 ns
|
Command User Interface |
NO
|
NO
|
Data Polling |
YES
|
YES
|
Data Retention Time-Min |
100
|
|
Endurance |
100000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
JESD-609 Code |
e3
|
e0
|
Length |
13.97 mm
|
13.97 mm
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
8000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
8KX8
|
8KX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC32,.5X.6
|
LDCC32,.5X.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Page Size |
64 words
|
64 words
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
245
|
|
Programming Voltage |
5 V
|
5 V
|
Seated Height-Max |
3.55 mm
|
3.55 mm
|
Standby Current-Max |
0.0002 A
|
0.0002 A
|
Supply Current-Max |
0.04 mA
|
0.04 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Toggle Bit |
YES
|
YES
|
Width |
11.43 mm
|
11.43 mm
|
Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Qualification Status |
|
Not Qualified
|
Temperature Grade |
|
MILITARY
|
|
|
|
Compare X28HC64JIZ-70T1 with alternatives
Compare X28HC64JM-70 with alternatives