X28HC64JIZ-70T1
vs
X28HC64J-70
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
XICOR INC
|
| Part Package Code |
PDIP, PLCC, SOIC
|
|
| Package Description |
ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32
|
PLASTIC, LCC-32
|
| Pin Count |
28, 32, 28
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Factory Lead Time |
26 Weeks
|
|
| Access Time-Max |
70 ns
|
70 ns
|
| Command User Interface |
NO
|
NO
|
| Data Polling |
YES
|
YES
|
| Endurance |
1000000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
| JESD-609 Code |
e3
|
e0
|
| Length |
13.97 mm
|
13.97 mm
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC32,.5X.6
|
LDCC32,.5X.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Page Size |
64 words
|
64 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.55 mm
|
3.56 mm
|
| Standby Current-Max |
0.0002 A
|
0.0002 A
|
| Supply Current-Max |
0.04 mA
|
0.04 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Toggle Bit |
YES
|
YES
|
| Width |
11.43 mm
|
11.43 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Additional Feature |
|
SOFTWARE DATA PROTECTION; 64 BYTE PAGE WRITE; 100 YEARS DATA RETENTION
|
| Data Retention Time-Min |
|
100
|
| Output Characteristics |
|
3-STATE
|
|
|
|
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