X28HC256JZ-90T1
vs
AT28HC256-90JJT/R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTERSIL CORP
ATMEL CORP
Part Package Code
PDIP, PLCC, SOIC
QFJ
Package Description
QCCJ, LDCC32,.5X.6
QCCJ,
Pin Count
28, 32, 28
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Factory Lead Time
26 Weeks
Access Time-Max
90 ns
90 ns
Command User Interface
NO
Data Polling
YES
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e3
e3
Length
13.97 mm
13.97 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
3
2
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Page Size
128 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.55 mm
3.55 mm
Standby Current-Max
0.0005 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Toggle Bit
YES
Width
11.43 mm
11.43 mm
Write Cycle Time-Max (tWC)
5 ms
Base Number Matches
2
1
Pbfree Code
Rohs Code
Additional Feature
AUTOMATIC WRITE
Output Characteristics
3-STATE
Compare X28HC256JZ-90T1 with alternatives
Compare AT28HC256-90JJT/R with alternatives