X28C256GM-35 vs AM28C256-350LCB feature comparison

X28C256GM-35 Xicor Inc

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AM28C256-350LCB AMD

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC ADVANCED MICRO DEVICES INC
Package Description FRIT SEALED, CERAMIC, LCC-32 QCCN,
Reach Compliance Code unknown unknown
Access Time-Max 350 ns 350 ns
Command User Interface NO
Data Polling YES
Endurance 10000 Write/Erase Cycles
JESD-30 Code R-GQCC-N32 R-CQCC-N32
JESD-609 Code e0
Length 13.97 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Page Size 64 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.048 mm
Standby Current-Max 0.0002 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Toggle Bit YES
Width 11.43 mm
Write Cycle Time-Max (tWC) 10 ms
Base Number Matches 1 1
Part Package Code QFJ
Pin Count 32
ECCN Code EAR99
HTS Code 8542.32.00.51

Compare X28C256GM-35 with alternatives

Compare AM28C256-350LCB with alternatives