AM28C256-350LCB vs 5962-8852509YA feature comparison

AM28C256-350LCB AMD

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5962-8852509YA LSI Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SEEQ TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description QCCN, QCCN,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 350 ns 350 ns
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Position QUAD QUAD
Base Number Matches 1 4
Pbfree Code No
Additional Feature HARDWARE & SOFTWARE DATA PROTECTION; DATA RETENTION = 10 YEARS
Data Retention Time-Min 10
JESD-609 Code e0
Length 13.95 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-STD-883 Class B
Seated Height-Max 2.54 mm
Supply Current-Max 0.08 mA
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.4 mm
Write Cycle Time-Max (tWC) 10 ms

Compare AM28C256-350LCB with alternatives

Compare 5962-8852509YA with alternatives