X28C256EI-25T1 vs X28C256EMB-25 feature comparison

X28C256EI-25T1 Xicor Inc

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X28C256EMB-25 Xicor Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC XICOR INC
Package Description CERAMIC, LCC-32 QCCN, LCC32,.45X.55
Reach Compliance Code unknown unknown
Access Time-Max 250 ns 250 ns
Additional Feature PAGE WRITE 100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Length 13.97 mm 13.97 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.05 mm 3.05 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.43 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
Rohs Code No
Command User Interface NO
Data Polling YES
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-609 Code e0
Package Equivalence Code LCC32,.45X.55
Page Size 64 words
Screening Level MIL-STD-883
Standby Current-Max 0.0005 A
Supply Current-Max 0.06 mA
Terminal Finish TIN LEAD
Toggle Bit YES

Compare X28C256EI-25T1 with alternatives

Compare X28C256EMB-25 with alternatives