X28C256EI-25T1
vs
LE28C256AH-250
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XICOR INC
SEEQ TECHNOLOGY INC
Package Description
CERAMIC, LCC-32
QCCN, LCC32,.45X.55
Reach Compliance Code
unknown
unknown
Access Time-Max
250 ns
250 ns
Additional Feature
PAGE WRITE
AUTOMATIC WRITE;PAGE WRITE;BULK ERASE
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
Length
13.97 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.05 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
Write Cycle Time-Max (tWC)
10 ms
3 ms
Base Number Matches
1
1
Rohs Code
ECCN Code
EAR99
HTS Code
8542.32.00.51
Command User Interface
NO
Data Polling
YES
Endurance
10000 Write/Erase Cycles
JESD-609 Code
e0
Package Equivalence Code
LCC32,.45X.55
Page Size
64 words
Standby Current-Max
0.00035 A
Supply Current-Max
0.06 mA
Terminal Finish
TIN LEAD
Toggle Bit
YES
Compare X28C256EI-25T1 with alternatives
Compare LE28C256AH-250 with alternatives