X28C010GM-25T1
vs
FT28C010-25EB-X
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XICOR INC
FORCE TECHNOLOGIES LTD
Package Description
FRIT SEALED, CERAMIC, LCC-32
QCCN,
Reach Compliance Code
unknown
unknown
Access Time-Max
250 ns
250 ns
JESD-30 Code
R-GQCC-N32
R-CQCC-N32
Length
13.97 mm
13.95 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
2.54 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.4 mm
Base Number Matches
1
1
Part Package Code
QFJ
Pin Count
32
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Screening Level
MIL-STD-883
Write Cycle Time-Max (tWC)
10 ms
Compare X28C010GM-25T1 with alternatives
Compare FT28C010-25EB-X with alternatives