X24320P-1.8 vs S524LB0D91-DI feature comparison

X24320P-1.8 IC Microsystems Sdn Bhd

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S524LB0D91-DI Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 DIP,
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 0.1 MHz
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
I2C Control Byte 1010DDDR
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0
Length 10.03 mm
Memory Density 32768 bit 32768 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4KX8 4KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.000001 A
Supply Current-Max 0.003 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 2 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 5 ms
Write Protection HARDWARE/SOFTWARE
Base Number Matches 2 1

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