S524LB0D91-DI
vs
M24C32-WBN6G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.1 MHz
0.4 MHz
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Memory Density
32768 bit
32768 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4KX8
4KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Serial Bus Type
I2C
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2.5 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
1
Pbfree Code
Rohs Code
Data Retention Time-Min
40
Endurance
1000000 Write/Erase Cycles
I2C Control Byte
1010DDDR
JESD-609 Code
e3
Length
9.27 mm
Package Equivalence Code
DIP8,.3
Screening Level
AEC-Q100
Seated Height-Max
5.33 mm
Standby Current-Max
0.000002 A
Supply Current-Max
0.005 mA
Terminal Finish
MATTE TIN
Terminal Pitch
2.54 mm
Width
7.62 mm
Write Protection
HARDWARE
Compare S524LB0D91-DI with alternatives
Compare M24C32-WBN6G with alternatives