WS59016CBM vs MAQ17502CE feature comparison

WS59016CBM Waferscale Integration Inc

Buy Now Datasheet

MAQ17502CE Dynex Semiconductor

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC GEC PLESSEY SEMICONDUCTORS
Reach Compliance Code unknown unknown
Clock Frequency-Max 12.5 MHz
External Data Bus Width 16 16
JESD-30 Code R-CDIP-T64 R-CDIP-T64
JESD-609 Code e0
Number of Terminals 64 64
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP64,.9
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 60 mA 35 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type BIT-SLICE MICROPROCESSOR BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches 3 1
Package Description ,
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01

Compare WS59016CBM with alternatives

Compare MAQ17502CE with alternatives