WS512K32N-25G2LCA
vs
AS8SLC128K32P-20L/883C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROSS COMPONENTS
Part Package Code
QFP
PGA
Package Description
QFP,
PGA, PGA66,11X11
Pin Count
68
66
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
20 ns
Additional Feature
USER CONFIGURABLE AS 2M X 8
Alternate Memory Width
16
JESD-30 Code
S-CQFP-G68
S-CPGA-P66
JESD-609 Code
e0
e0
Length
22.36 mm
27.305 mm
Memory Density
16777216 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
68
66
Number of Words
524288 words
131072 words
Number of Words Code
512000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
512KX32
128KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
PGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.1 mm
4.953 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
PERPENDICULAR
Width
22.36 mm
27.305 mm
Base Number Matches
3
1
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
PGA66,11X11
Screening Level
MIL-STD-883 Class C
Standby Current-Max
0.024 A
Standby Voltage-Min
2 V
Supply Current-Max
0.16 mA
Compare WS512K32N-25G2LCA with alternatives
Compare AS8SLC128K32P-20L/883C with alternatives