WS128K32N-35HC
vs
WS128K32N-35HSIE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
WHITE ELECTRONIC DESIGNS CORP
Package Description
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code
unknown
unknown
Access Time-Max
35 ns
35 ns
Additional Feature
CONFIGURABLE AS 128K X 32
USER CONFIGURABLE AS 128K X 32
Alternate Memory Width
8
8
JESD-30 Code
S-CPGA-P66
S-CPGA-P66
Length
30.1 mm
30.1 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256K16
256K16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
6.22 mm
6.22 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
30.1 mm
30.1 mm
Base Number Matches
2
2
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare WS128K32N-35HC with alternatives
Compare WS128K32N-35HSIE with alternatives