WS128K32N-35G2TCE
vs
WS128K32N-35G2TIE
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
Package Description |
22.4 X 22.4 MM, CERAMIC, QFP-68
|
22.4 X 22.4 MM, CERAMIC, QFP-68
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
35 ns
|
35 ns
|
JESD-30 Code |
S-CQFP-G68
|
S-CQFP-G68
|
JESD-609 Code |
e4
|
e4
|
Length |
22.36 mm
|
22.36 mm
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
128KX32
|
128KX32
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFP
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
GOLD
|
GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
22.36 mm
|
22.36 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare WS128K32N-35G2TCE with alternatives
Compare WS128K32N-35G2TIE with alternatives