WS128K32N-35G2TCE
vs
WS128K32N-35G2LI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
WHITE ELECTRONIC DESIGNS CORP
Package Description
QFP,
22.36 X 22.36 MM, CERAMIC, QFP-68
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
35 ns
35 ns
Additional Feature
IT ALSO HAVE MEMROY WIDTH X 8
Alternate Memory Width
16
JESD-30 Code
S-CQFP-G68
S-CQFP-G68
Length
22.36 mm
22.36 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX32
128KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
4.57 mm
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
22.36 mm
22.36 mm
Base Number Matches
2
2
Rohs Code
JESD-609 Code
e4
Qualification Status
Not Qualified
Terminal Finish
GOLD
Compare WS128K32N-35G2TCE with alternatives
Compare WS128K32N-35G2LI with alternatives