WS128K32-20G2TI
vs
WS128K32-20G2C
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
,
|
22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68
|
| Pin Count |
68
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
20 ns
|
20 ns
|
| Additional Feature |
USER CONFIGURABLE AS 512K X 8
|
CONFIGURABLE AS 128K X 32
|
| Alternate Memory Width |
16
|
|
| JESD-30 Code |
S-CQMA-G68
|
S-CQFP-G68
|
| JESD-609 Code |
e4
|
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
32
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
131072 words
|
524288 words
|
| Number of Words Code |
128000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX32
|
512KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
2
|
3
|
| Length |
|
22.4 mm
|
| Package Code |
|
QFP
|
| Seated Height-Max |
|
5.1 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
22.4 mm
|
|
|
|
Compare WS128K32-20G2TI with alternatives
Compare WS128K32-20G2C with alternatives