WS128K32-15H1QA
vs
WS128K32-15G2IA
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
WHITE MICROELECTRONICS
|
WHITE ELECTRONIC DESIGNS CORP
|
| Package Description |
HERMETIC SEALED, CERAMIC, HIP-66
|
22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
15 ns
|
15 ns
|
| Additional Feature |
USER CONFIGURABLE AS 512K X 8
|
USER CONFIGURABLE AS 256K X 16 OR 128K X 32
|
| Alternate Memory Width |
16
|
|
| JESD-30 Code |
S-CHIP-P66
|
S-CQFP-G68
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
32
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
66
|
68
|
| Number of Words |
131072 words
|
524288 words
|
| Number of Words Code |
128000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
128KX32
|
512KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
PIN/PEG
|
GULL WING
|
| Terminal Position |
HEX
|
QUAD
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Length |
|
22.4 mm
|
| Package Code |
|
QFP
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
5.1 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
22.4 mm
|
|
|
|
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