WMS512K8L-17CLMA
vs
WMS512K8L-17CLQA
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
WHITE MICROELECTRONICS
|
MICROSEMI CORP
|
| Package Description |
CERAMIC, QCC-32
|
BRAZED, CERAMIC, LCC-32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
17 ns
|
17 ns
|
| Additional Feature |
BATTERY BACKUP
|
|
| JESD-30 Code |
R-CQCC-N32
|
R-CQCC-N32
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
512KX8
|
512KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
4
|
3
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFJ
|
| Pin Count |
|
32
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
MIL-STD-883
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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