WMS512K8-L45CLC
vs
HM62W8512ALRR-8
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
QFJ
|
TSOP2
|
Package Description |
QCCN,
|
TSOP2-R,
|
Pin Count |
32
|
32
|
Reach Compliance Code |
unknown
|
compliant
|
Access Time-Max |
45 ns
|
85 ns
|
JESD-30 Code |
R-CQCC-N32
|
R-PDSO-G32
|
JESD-609 Code |
e4
|
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
512KX8
|
512KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QCCN
|
TSOP2-R
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
GOLD
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
Additional Feature |
|
TTL COMPATIBLE INPUTS/OUTPUTS;BATTERY BACKUP
|
Length |
|
20.95 mm
|
Seated Height-Max |
|
1.2 mm
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
10.16 mm
|
|
|
|
Compare WMS512K8-L45CLC with alternatives
Compare HM62W8512ALRR-8 with alternatives