Part Details for HM62W8512ALRR-8 by Renesas Electronics Corporation
Overview of HM62W8512ALRR-8 by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for HM62W8512ALRR-8
HM62W8512ALRR-8 CAD Models
HM62W8512ALRR-8 Part Data Attributes
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HM62W8512ALRR-8
Renesas Electronics Corporation
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Datasheet
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HM62W8512ALRR-8
Renesas Electronics Corporation
512KX8 STANDARD SRAM, 85ns, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | TSOP2 | |
Package Description | TSOP2-R, | |
Pin Count | 32 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 85 ns | |
Additional Feature | TTL COMPATIBLE INPUTS/OUTPUTS;BATTERY BACKUP | |
JESD-30 Code | R-PDSO-G32 | |
Length | 20.95 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSOP2-R | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 10.16 mm |
Alternate Parts for HM62W8512ALRR-8
This table gives cross-reference parts and alternative options found for HM62W8512ALRR-8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM62W8512ALRR-8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MS8512SCMB-12 | SRAM Module, 512KX8, 120ns, CMOS | Mosaic Semiconductor Inc | HM62W8512ALRR-8 vs MS8512SCMB-12 |
MSM8512W-020 | Standard SRAM, 512KX8, 20ns, CMOS, CQCC32, CERAMIC, LCC-32 | Mosaic Semiconductor Inc | HM62W8512ALRR-8 vs MSM8512W-020 |
UT7Q512K8-UPC | Standard SRAM, 512KX8, 100ns, CMOS, CDFP32, BOTTOM BRAZED, CERAMIC, FP-32 | Cobham Semiconductor Solutions | HM62W8512ALRR-8 vs UT7Q512K8-UPC |
5962-9560009QUX | Standard SRAM, 512KX8, 45ns, CMOS, SOJ-32 | Microsemi Corporation | HM62W8512ALRR-8 vs 5962-9560009QUX |
WMS512K8-L45FFCA | 512KX8 STANDARD SRAM, 45ns, DFP32, CERAMIC,DFP-32 | Microsemi Corporation | HM62W8512ALRR-8 vs WMS512K8-L45FFCA |
HM658512ALRR-10V | Pseudo Static RAM, 512KX8, 100ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32 | Hitachi Ltd | HM62W8512ALRR-8 vs HM658512ALRR-10V |
WS512K8-100CMEA | SRAM Module, 512KX8, 100ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | HM62W8512ALRR-8 vs WS512K8-100CMEA |
DPS512S8N-10M | SRAM Module, 512KX8, 100ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | B&B Electronics Manufacturing Company | HM62W8512ALRR-8 vs DPS512S8N-10M |
5962-9561329HYX | Standard SRAM, 512KX8, 12ns, CMOS, CDIP32, CERAMIC, DIP-32 | Microsemi Corporation | HM62W8512ALRR-8 vs 5962-9561329HYX |
HM658512ALP-8 | 512KX8 PSEUDO STATIC RAM, 80ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Renesas Electronics Corporation | HM62W8512ALRR-8 vs HM658512ALP-8 |