WMS512K8-L15CIA
vs
HM658512ALFP-10T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROSEMI CORP
RENESAS TECHNOLOGY CORP
Part Package Code
DIP
SOIC
Package Description
DIP,
SOP,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
Access Time-Max
15 ns
100 ns
JESD-30 Code
R-CDIP-T32
R-PDSO-G32
Length
42.2 mm
20.45 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
PSEUDO STATIC RAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX8
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.13 mm
3 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
1
2
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Terminal Pitch
1.27 mm
Width
11.3 mm
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