WF2M32BI-90HM5
vs
WF2M32BI-90HI5A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
WHITE MICROELECTRONICS
WHITE ELECTRONIC DESIGNS CORP
Reach Compliance Code
unknown
unknown
Access Time-Max
90 ns
90 ns
Additional Feature
USER CONFIGURABLE AS 4M X 16 OR 2M X 32; 100000 WRITE/ERASE CYCLES MIN
USER CONFIGURABLE AS 4M X 16 OR 2M X 32; 100000 WRITE/ERASE CYCLES MIN
JESD-30 Code
S-CHIP-P66
S-CPGA-P66
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH MODULE
FLASH MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8MX8
8MX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
HEX
PERPENDICULAR
Type
NOR TYPE
NOR TYPE
Base Number Matches
4
4
Rohs Code
Package Description
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
ECCN Code
EAR99
HTS Code
8542.32.00.51
JESD-609 Code
e0
Length
30.1 mm
Package Code
PGA
Seated Height-Max
6.22 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
30.1 mm