WF128K32N-150HC5A vs M28W160ECB70ZB1U feature comparison

WF128K32N-150HC5A Microsemi Corporation

Buy Now Datasheet

M28W160ECB70ZB1U Numonyx Memory Solutions

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP NUMONYX
Part Package Code PGA BGA
Package Description 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 TFBGA,
Pin Count 66 46
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 150 ns
Additional Feature CONFIGURABLE AS 128K X 32 BOTTOM BOOT BLOCK
Alternate Memory Width 16
JESD-30 Code S-CPGA-P66 R-PBGA-B46
Length 30.1 mm 6.39 mm
Memory Density 4194304 bit 16777216 bit
Memory IC Type FLASH MODULE FLASH
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 66 46
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX8 1MX16
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA TFBGA
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.22 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form PIN/PEG BALL
Terminal Pitch 2.54 mm 0.75 mm
Terminal Position PERPENDICULAR BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE NOR TYPE
Width 30.1 mm 6.37 mm
Base Number Matches 3 1
Boot Block BOTTOM

Compare WF128K32N-150HC5A with alternatives

Compare M28W160ECB70ZB1U with alternatives