WF128K32-150H1Q5 vs X2402DMB feature comparison

WF128K32-150H1Q5 White Electronic Designs Corp

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X2402DMB Xicor Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP XICOR INC
Package Description PGA, PGA66,11X11
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 150 ns
Data Polling YES
JESD-30 Code S-XPGA-P66 R-XDIP-T8
Memory Density 4194304 bit 2048 bit
Memory IC Type FLASH MODULE EEPROM
Memory Width 32 8
Number of Sectors/Size 8
Number of Terminals 66 8
Number of Words 131072 words 256 words
Number of Words Code 128000 256
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX32 256X8
Package Body Material CERAMIC CERAMIC
Package Code PGA DIP
Package Equivalence Code PGA66,11X11 DIP8,.3
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY IN-LINE
Page Size 128 words
Parallel/Serial PARALLEL SERIAL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Sector Size 16K
Standby Current-Max 0.0065 A 0.03 A
Supply Current-Max 0.2 mA 0.035 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade MILITARY MILITARY
Terminal Form PIN/PEG THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR DUAL
Toggle Bit YES
Type NOR TYPE
Base Number Matches 1 1
Rohs Code No
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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