WED3C7410E16M-400BM vs MC9328MXLDVP15R2 feature comparison

WED3C7410E16M-400BM Microsemi Corporation

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MC9328MXLDVP15R2 Freescale Semiconductor

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP-PMG MICROELECTRONICS FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 21 X 25 MM, CERAMIC, BGA-225 13 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-225
Pin Count 225 225
Reach Compliance Code unknown compliant
Address Bus Width 32 25
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 16 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code R-CBGA-B225 S-PBGA-B225
Low Power Mode NO YES
Number of Terminals 225 225
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C -30 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code BGA LFBGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Speed 400 MHz 150 MHz
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade MILITARY OTHER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Bit Size 32
Length 13 mm
Moisture Sensitivity Level 3
Package Equivalence Code BGA225,15X15,32
Seated Height-Max 1.6 mm
Technology CMOS
Terminal Finish TIN SILVER COPPER OVER NICKEL
Terminal Pitch 0.8 mm
Width 13 mm

Compare WED3C7410E16M-400BM with alternatives

Compare MC9328MXLDVP15R2 with alternatives