WED3C7410E16M-400BC vs MCF5253VM140 feature comparison

WED3C7410E16M-400BC Microsemi Corporation

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MCF5253VM140 Freescale Semiconductor

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROSEMI CORP-PMG MICROELECTRONICS FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, MAPBGA-225
Pin Count 225 225
Reach Compliance Code unknown compliant
Address Bus Width 32 16
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 35 MHz
External Data Bus Width 64 16
Format FLOATING POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code R-CBGA-B225 S-PBGA-B225
Low Power Mode NO NO
Number of Terminals 225 225
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code BGA FBGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Speed 400 MHz 140 MHz
Supply Voltage-Max 1.9 V 1.32 V
Supply Voltage-Min 1.7 V 1.08 V
Supply Voltage-Nom 1.8 V 1.2 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 2
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Bit Size 32
Length 13 mm
Moisture Sensitivity Level 3
Package Equivalence Code BGA225,15X15,32
Seated Height-Max 2.85 mm
Technology CMOS
Terminal Finish TIN SILVER COPPER OVER NICKEL
Terminal Pitch 0.8 mm
Width 13 mm

Compare WED3C7410E16M-400BC with alternatives

Compare MCF5253VM140 with alternatives