WED3C7410E16M-400BC
vs
MCF5253VM140
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP-PMG MICROELECTRONICS
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
13 X 13 MM, 0.80 MM PITCH, LEAD FREE, MAPBGA-225
|
Pin Count |
225
|
225
|
Reach Compliance Code |
unknown
|
compliant
|
Address Bus Width |
32
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
35 MHz
|
External Data Bus Width |
64
|
16
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
NO
|
JESD-30 Code |
R-CBGA-B225
|
S-PBGA-B225
|
Low Power Mode |
NO
|
NO
|
Number of Terminals |
225
|
225
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
-20 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
FBGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
400 MHz
|
140 MHz
|
Supply Voltage-Max |
1.9 V
|
1.32 V
|
Supply Voltage-Min |
1.7 V
|
1.08 V
|
Supply Voltage-Nom |
1.8 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
3A991.A.2
|
HTS Code |
|
8542.31.00.01
|
Samacsys Manufacturer |
|
NXP
|
Bit Size |
|
32
|
Length |
|
13 mm
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA225,15X15,32
|
Seated Height-Max |
|
2.85 mm
|
Technology |
|
CMOS
|
Terminal Finish |
|
TIN SILVER COPPER OVER NICKEL
|
Terminal Pitch |
|
0.8 mm
|
Width |
|
13 mm
|
|
|
|
Compare WED3C7410E16M-400BC with alternatives
Compare MCF5253VM140 with alternatives