WED3C7410E16M-400BC
vs
MC9328MXSCVP10R2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP-PMG MICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA,
|
LFBGA,
|
| Pin Count |
225
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Address Bus Width |
32
|
25
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
16 MHz
|
| External Data Bus Width |
64
|
32
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
R-CBGA-B225
|
S-PBGA-B225
|
| Low Power Mode |
NO
|
YES
|
| Number of Terminals |
225
|
225
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFBGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
400 MHz
|
100 MHz
|
| Supply Voltage-Max |
1.9 V
|
1.9 V
|
| Supply Voltage-Min |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Bit Size |
|
32
|
| JESD-609 Code |
|
e1
|
| Length |
|
13 mm
|
| Moisture Sensitivity Level |
|
3
|
| Seated Height-Max |
|
1.6 mm
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Pitch |
|
0.8 mm
|
| Width |
|
13 mm
|
|
|
|
Compare WED3C7410E16M-400BC with alternatives
Compare MC9328MXSCVP10R2 with alternatives