W9825G2JB-75
vs
K4M56323LE-EL1H
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA-90
|
LFBGA, BGA90,9X15,32
|
Pin Count |
90
|
90
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.24
|
8542.32.00.24
|
Samacsys Manufacturer |
Winbond
|
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
5.4 ns
|
7 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
133 MHz
|
105 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
1,2,4,8
|
1,2,4,8
|
JESD-30 Code |
R-PBGA-B90
|
R-PBGA-B90
|
Length |
13 mm
|
13 mm
|
Memory Density |
268435456 bit
|
268435456 bit
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
90
|
90
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
-25 °C
|
Organization |
8MX32
|
8MX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
LFBGA
|
Package Equivalence Code |
BGA90,9X15,32
|
BGA90,9X15,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
4096
|
4096
|
Seated Height-Max |
1.2 mm
|
1.4 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
1,2,4,8,FP
|
1,2,4,8,FP
|
Standby Current-Max |
0.004 A
|
0.0012 A
|
Supply Current-Max |
0.14 mA
|
0.29 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
8 mm
|
11 mm
|
Base Number Matches |
2
|
2
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare W9825G2JB-75 with alternatives
Compare K4M56323LE-EL1H with alternatives