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W72M64VB100BC vs W72M64VB100BM feature comparison

W72M64VB100BC Microsemi Corporation

Buy Now Datasheet

W72M64VB100BM Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 159 159
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code R-PBGA-B159 R-PBGA-B159
Memory Density 268435456 bit 268435456 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 64 64
Number of Functions 1 1
Number of Terminals 159 159
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 4MX64 4MX64
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 2 2
Memory » Other Memory ICs
Memory » Other Memory ICs

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