W72M64VB100BM
vs
W72M64VB90BI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
BGA
Package Description
BGA,
13 X 22 MM, PLASTIC, BGA-159
Pin Count
159
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
R-PBGA-B159
R-PBGA-B159
Memory Density
268435456 bit
268435456 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
64
64
Number of Functions
1
1
Number of Terminals
159
159
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
4MX64
4MX64
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Base Number Matches
2
2
Access Time-Max
90 ns
Boot Block
BOTTOM
Command User Interface
NO
Data Polling
YES
Length
19.05 mm
Number of Sectors/Size
8,64
Package Equivalence Code
BGA159,10X16,50
Parallel/Serial
PARALLEL
Ready/Busy
YES
Sector Size
4K,32K
Standby Current-Max
0.000021 A
Supply Current-Max
0.14 mA
Terminal Pitch
1.27 mm
Toggle Bit
YES
Type
NOR TYPE
Width
11.43 mm
Write Protection
HARDWARE
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