W72M64VB100BC
vs
W72M64VB70BM
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA, BGA159,10X16,50
|
Pin Count |
159
|
159
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
JESD-30 Code |
R-PBGA-B159
|
R-PBGA-B159
|
Memory Density |
268435456 bit
|
134217728 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
64
|
64
|
Number of Functions |
1
|
|
Number of Terminals |
159
|
159
|
Number of Words |
4194304 words
|
2097152 words
|
Number of Words Code |
4000000
|
2000000
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
4MX64
|
2MX64
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
1
|
1
|
Access Time-Max |
|
70 ns
|
Boot Block |
|
BOTTOM
|
Command User Interface |
|
NO
|
Data Polling |
|
YES
|
Number of Sectors/Size |
|
8,64
|
Package Equivalence Code |
|
BGA159,10X16,50
|
Parallel/Serial |
|
PARALLEL
|
Ready/Busy |
|
YES
|
Sector Size |
|
4K,32K
|
Standby Current-Max |
|
0.000021 A
|
Supply Current-Max |
|
0.14 mA
|
Terminal Pitch |
|
1.27 mm
|
Toggle Bit |
|
YES
|
Type |
|
NOR TYPE
|
Write Protection |
|
HARDWARE
|
|
|
|
Compare W72M64VB100BC with alternatives
Compare W72M64VB70BM with alternatives