W72M64VB100BC vs W72M64VB70BM feature comparison

W72M64VB100BC Microsemi Corporation

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W72M64VB70BM Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code BGA BGA
Package Description BGA, BGA, BGA159,10X16,50
Pin Count 159 159
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code R-PBGA-B159 R-PBGA-B159
Memory Density 268435456 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 64 64
Number of Functions 1
Number of Terminals 159 159
Number of Words 4194304 words 2097152 words
Number of Words Code 4000000 2000000
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 4MX64 2MX64
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
Access Time-Max 70 ns
Boot Block BOTTOM
Command User Interface NO
Data Polling YES
Number of Sectors/Size 8,64
Package Equivalence Code BGA159,10X16,50
Parallel/Serial PARALLEL
Ready/Busy YES
Sector Size 4K,32K
Standby Current-Max 0.000021 A
Supply Current-Max 0.14 mA
Terminal Pitch 1.27 mm
Toggle Bit YES
Type NOR TYPE
Write Protection HARDWARE

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