W631GG8MB-12 vs MT41J128M8HX-125IT:E feature comparison

W631GG8MB-12 Winbond Electronics Corp

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MT41J128M8HX-125IT:E Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description VFBGA-78 TFBGA,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Date Of Intro 2017-12-01
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B78 R-PBGA-B78
Length 10.5 mm 11.5 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 78 78
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.575 V 1.575 V
Supply Voltage-Min (Vsup) 1.425 V 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 9 mm
Base Number Matches 3 1
Part Package Code BGA
Pin Count 78
Qualification Status Not Qualified

Compare W631GG8MB-12 with alternatives

Compare MT41J128M8HX-125IT:E with alternatives