W3J128M72G-1066PBM
vs
W3J128M72G-800PBID
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MERCURY SYSTEMS INC
MERCURY SYSTEMS INC
Package Description
BGA, BGA375(UNSPEC)
20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
SINGLE BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
Interleaved Burst Length
8
JESD-30 Code
R-PBGA-B375
R-PBGA-B375
JESD-609 Code
e0
Memory Density
8589934592 bit
9663676416 bit
Memory IC Type
DDR3 DRAM
DDR DRAM
Memory Width
72
72
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
375
375
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
128MX72
128MX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA375(UNSPEC)
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Reverse Pinout
NO
Self Refresh
YES
YES
Sequential Burst Length
8
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
2
Rohs Code
Length
21.75 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
6 mm
Supply Voltage-Max (Vsup)
1.575 V
Supply Voltage-Min (Vsup)
1.425 V
Terminal Pitch
1 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
20.75 mm
Compare W3J128M72G-1066PBM with alternatives
Compare W3J128M72G-800PBID with alternatives