W3J128M72G-800PBID
vs
W3J128M72G-800PBC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MERCURY SYSTEMS INC
Part Package Code
BGA
Package Description
BGA,
BGA, BGA375(UNSPEC)
Pin Count
375
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
SINGLE BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B375
R-PBGA-B375
Length
21.75 mm
Memory Density
9663676416 bit
8589934592 bit
Memory IC Type
DDR DRAM
DDR3 DRAM
Memory Width
72
72
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
375
375
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128MX72
128MX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
6 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.575 V
Supply Voltage-Min (Vsup)
1.425 V
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
20.75 mm
Base Number Matches
2
2
Interleaved Burst Length
8
Package Equivalence Code
BGA375(UNSPEC)
Reverse Pinout
NO
Sequential Burst Length
8
Compare W3J128M72G-800PBID with alternatives
Compare W3J128M72G-800PBC with alternatives