W3DG6417V10D2
vs
KMM364E1600BK-5
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIMM
Package Description
DIMM,
DIMM, DIMM168
Pin Count
168
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FOUR BANK PAGE BURST
FAST PAGE WITH EDO
Additional Feature
AUTO/SELF REFRESH
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
EDO DRAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX64
16MX64
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
1
1
Access Time-Max
50 ns
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIMM168
Refresh Cycles
4096
Standby Current-Max
0.03 A
Supply Current-Max
1.92 mA
Terminal Pitch
1.27 mm
Compare W3DG6417V10D2 with alternatives
Compare KMM364E1600BK-5 with alternatives