Part Details for W3DG6417V10D2 by Microsemi Corporation
Overview of W3DG6417V10D2 by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for W3DG6417V10D2
W3DG6417V10D2 CAD Models
W3DG6417V10D2 Part Data Attributes
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W3DG6417V10D2
Microsemi Corporation
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Datasheet
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W3DG6417V10D2
Microsemi Corporation
Synchronous DRAM Module, 16MX64, CMOS, DIMM-168
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | DIMM | |
Package Description | DIMM, | |
Pin Count | 168 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Access Mode | FOUR BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-XDMA-N168 | |
Memory Density | 1073741824 bit | |
Memory IC Type | SYNCHRONOUS DRAM MODULE | |
Memory Width | 64 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 168 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 16MX64 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for W3DG6417V10D2
This table gives cross-reference parts and alternative options found for W3DG6417V10D2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W3DG6417V10D2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
HYM71V16655AT8M-P | Synchronous DRAM Module, 16MX64, 6ns, CMOS, DIMM-168 | SK Hynix Inc | W3DG6417V10D2 vs HYM71V16655AT8M-P |
M364C1680CJ0-C60 | Fast Page DRAM Module, 16MX64, 60ns, CMOS, DIMM-168 | Samsung Semiconductor | W3DG6417V10D2 vs M364C1680CJ0-C60 |
HYM5V641634TKG-60 | EDO DRAM Module, 16MX64, 60ns, CMOS, PDMA168, DIMM-168 | SK Hynix Inc | W3DG6417V10D2 vs HYM5V641634TKG-60 |
MH16V6445BWJ-5 | EDO DRAM Module, 16MX64, 50ns, CMOS, DIMM-168 | Mitsubishi Electric | W3DG6417V10D2 vs MH16V6445BWJ-5 |
WED3DG6316V7D2 | Synchronous DRAM Module, 16MX64, CMOS, DIMM-168 | Microsemi Corporation | W3DG6417V10D2 vs WED3DG6316V7D2 |
VS1664648041DTGA-8H | Synchronous DRAM Module, 16MX64, 6ns, CMOS, DIMM-168 | Vanguard International Semiconductor Corporation | W3DG6417V10D2 vs VS1664648041DTGA-8H |
MH16S64PHB-10 | Synchronous DRAM Module, 16MX64, 8ns, CMOS, DIMM-168 | Mitsubishi Electric | W3DG6417V10D2 vs MH16S64PHB-10 |
MC-4516CB647XFA-A75A | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, DIMM-168 | Elpida Memory Inc | W3DG6417V10D2 vs MC-4516CB647XFA-A75A |
KMM364E1600BK-5 | EDO DRAM Module, 16MX64, 50ns, CMOS | Samsung Semiconductor | W3DG6417V10D2 vs KMM364E1600BK-5 |
WED3DG6318V75D2 | Synchronous DRAM Module, 16MX64, CMOS, DIMM-168 | Microsemi Corporation | W3DG6417V10D2 vs WED3DG6318V75D2 |