W29N08GVBJAA
vs
W29N08GVSJAD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Package Description
VFBGA, BGA63,10X12,32
,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Winbond
Alternate Memory Width
1
Command User Interface
NO
Data Polling
NO
Data Retention Time-Min
10
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B63
Length
11 mm
Memory Density
8589934592 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
Number of Functions
1
Number of Sectors/Size
8K
Number of Terminals
63
Number of Words
1073741824 words
Number of Words Code
1000000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Organization
1GX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Equivalence Code
BGA63,10X12,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size
2K words
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3.3 V
3.3 V
Ready/Busy
YES
Seated Height-Max
1 mm
Sector Size
128K
Standby Current-Max
0.00005 A
Supply Current-Max
0.035 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
YES
Type
SLC NAND TYPE
SLC NAND TYPE
Width
9 mm
Write Cycle Time-Max (tWC)
0.025 ms
Base Number Matches
1
1
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