W29N08GVBIAD vs MT29F8G08ABACAWP-IT feature comparison

W29N08GVBIAD Winbond Electronics Corp

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MT29F8G08ABACAWP-IT Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description VFBGA, TSOP-48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Data Retention Time-Min 10
JESD-30 Code R-PBGA-B63 R-PDSO-G48
Length 11 mm 18.4 mm
Memory Density 8589934592 bit 8589934592 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 48
Number of Words 1073741824 words 1073741824 words
Number of Words Code 1000000000 1000000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1GX8 1GX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TSOP1
Package Equivalence Code BGA63,10X12,32 TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programming Voltage 3.3 V 3.3 V
Seated Height-Max 1 mm 1.2 mm
Standby Current-Max 0.00005 A 0.0001 A
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 12 mm
Write Cycle Time-Max (tWC) 0.025 ms
Base Number Matches 1 1
Command User Interface YES
Number of Sectors/Size 4K
Output Characteristics 3-STATE
Page Size 4K words
Ready/Busy YES
Sector Size 256K

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