W29EE512P-70-TR vs SST29SF512-70-4I-NH feature comparison

W29EE512P-70-TR Winbond Electronics Corp

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SST29SF512-70-4I-NH Silicon Storage Technology

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP SILICON STORAGE TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description QCCJ, PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature HARDWARE AND SOFTWARE DATA PROTECTION; 10-YEARS DATA RETENTION; 1K PROGRAM/ERASE CYCLE
Data Retention Time-Min 10
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0
Length 13.97 mm 13.97 mm
Memory Density 524288 bit 524288 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64KX8 64KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Seated Height-Max 3.56 mm 3.55 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Type NOR TYPE
Width 11.43 mm 11.43 mm
Write Cycle Time-Max (tWC) 10 ms
Base Number Matches 1 1
Qualification Status Not Qualified

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