W27L010P-12 vs AT27LV256R-30JI feature comparison

W27L010P-12 Winbond Electronics Corp

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AT27LV256R-30JI Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer WINBOND ELECTRONICS CORP MICROCHIP TECHNOLOGY INC
Part Package Code QFJ
Package Description QCCJ, LDCC32,.5X.6
Pin Count 32
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.71
Access Time-Max 120 ns 270 ns
Additional Feature TTL/CMOS COMPATIBLE INPUT & OUTPUT
Command User Interface NO
Data Polling NO
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0 e0
Length 13.97 mm
Memory Density 1048576 bit 262144 bit
Memory IC Type EEPROM OTP ROM
Memory Width 8 8
Number of Functions 1
Number of Terminals 32 32
Number of Words 131072 words 32768 words
Number of Words Code 128000 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC32,.5X.6 LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL
Programming Voltage 12 V 13 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.56 mm
Standby Current-Max 0.00002 A 0.0001 A
Supply Current-Max 0.01 mA 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Toggle Bit NO
Width 11.43 mm
Base Number Matches 1 2
I/O Type COMMON
Moisture Sensitivity Level 2
Output Characteristics 3-STATE

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Compare AT27LV256R-30JI with alternatives