W26B021T70LL vs BS616UV2019TCG10 feature comparison

W26B021T70LL Winbond Electronics Corp

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BS616UV2019TCG10 Brilliance Semiconductor Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP BRILLIANCE SEMICONDUCTOR INC
Part Package Code TSOP1 TSOP1
Package Description TSOP1, TSSOP48,.71,20 TSOP1, TSSOP48,.71,20
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 100 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3
Length 16.4 mm 16.4 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX16 128KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Equivalence Code TSSOP48,.71,20 TSSOP48,.71,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Voltage-Min 1.5 V 1 V
Supply Current-Max 0.02 mA 0.011 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.2 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 11.8 mm
Base Number Matches 1 1
Rohs Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Standby Current-Max 7e-7 A

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