W26B021T10LE
vs
BS616LV2019TCG70
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
BRILLIANCE SEMICONDUCTOR INC
Part Package Code
TSOP1
TSOP1
Package Description
TSOP1, TSSOP48,.71,20
TSOP1, TSSOP48,.71,20
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e3
Length
16.4 mm
16.4 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-20 °C
Organization
128KX16
128KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Equivalence Code
TSSOP48,.71,20
TSSOP48,.71,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Voltage-Min
1.5 V
1.5 V
Supply Current-Max
0.02 mA
0.015 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.2 V
2.4 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
12 mm
11.8 mm
Base Number Matches
1
1
Rohs Code
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Standby Current-Max
7e-7 A
Compare W26B021T10LE with alternatives
Compare BS616LV2019TCG70 with alternatives