W25X64VZEIZ
vs
M25PX64SOVME6EA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
Part Package Code
SON
Package Description
SON, SOLCC8,.25
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
33 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
Length
8 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
Number of Functions
1
Number of Terminals
8
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
SON
Package Equivalence Code
SOLCC8,.25
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Parallel/Serial
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
2.7 V
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.00001 A
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
Width
6 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
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Compare M25PX64SOVME6EA with alternatives