W25X16VDAI vs AT45DB161D-MU feature comparison

W25X16VDAI Winbond Electronics Corp

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AT45DB161D-MU Atmel Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP ATMEL CORP
Part Package Code DIP DFN
Package Description DIP, DIP8,.3 6 X 5 MM, 1 MM HEIGHT, GREEN, MLF-8
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 33 MHz 66 MHz
Data Retention Time-Min 20 20
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDSO-N8
Length 9.14 mm 6 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 1
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2097152 words 16777216 words
Number of Words Code 2000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 16MX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP VSON
Package Equivalence Code DIP8,.3 SOLCC8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 1 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.00001 A 0.000025 A
Supply Current-Max 0.025 mA 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 7.62 mm 5 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 2
Manufacturer Package Code MLF
Additional Feature ORGANIZED AS 4096 PAGES OF 528 BYTES EACH
JESD-609 Code e3
Terminal Finish MATTE TIN

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