W25Q80VSSIG vs W25Q80VSSI feature comparison

W25Q80VSSIG Winbond Electronics Corp

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W25Q80VSSI Winbond Electronics Corp

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 8 8
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 80 MHz 80 MHz
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e3 e0
Length 5.28 mm 5.28 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.16 mm 2.16 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Width 5.28 mm 5.28 mm
Base Number Matches 1 1

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