W25Q80VSSI vs W25X80-VSSI-G feature comparison

W25Q80VSSI Winbond Electronics Corp

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W25X80-VSSI-G Nexflash Technologies Inc

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP NEXFLASH TECHNOLOGIES INC
Part Package Code SOIC
Package Description SOP, SOP, SOP8,.3
Pin Count 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 80 MHz 85 MHz
JESD-30 Code S-PDSO-G8 R-PDSO-G8
JESD-609 Code e0
Length 5.28 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1
Number of Terminals 8 8
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.16 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.28 mm
Base Number Matches 1 2
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code SOP8,.3
Serial Bus Type SPI
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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