W25Q80BVSNIG
vs
M25PX32STVMP3E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
Part Package Code
SOIC
Package Description
0.150 INCH, GREEN, PLASTIC, SOIC-8
HVSON,
Pin Count
8
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.1.B.1
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Winbond
Clock Frequency-Max (fCLK)
80 MHz
75 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-G8
R-PDSO-N8
Length
4.9 mm
6 mm
Memory Density
8388608 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1048576 words
4194304 words
Number of Words Code
1000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX8
4MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVSON
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
2.7 V
Qualification Status
Not Qualified
Seated Height-Max
1.75 mm
1 mm
Serial Bus Type
SPI
Standby Current-Max
0.000005 A
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
3.9 mm
5 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
Compare W25Q80BVSNIG with alternatives
Compare M25PX32STVMP3E with alternatives