W25Q64JVZEJQ
vs
W25Q64CVZEJP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Package Description
WSON-8
HVSON,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Date Of Intro
2018-04-03
Samacsys Manufacturer
Winbond
Winbond
Additional Feature
IT ALSO OPERATES AT 2.7V @ 104MHZ
Alternate Memory Width
1
Clock Frequency-Max (fCLK)
133 MHz
80 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
Length
8 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
HVSON
Package Equivalence Code
SOLCC8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
3 V
Seated Height-Max
0.8 mm
0.8 mm
Serial Bus Type
SPI
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
Width
6 mm
6 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
Screening Level
AEC-Q100
Compare W25Q64JVZEJQ with alternatives
Compare W25Q64CVZEJP with alternatives